Cooling Techniques for Electronic Equipment, 2nd Edition Review

Average Reviews:

(More customer reviews)As a mechanical engineer who designs packaging for electronic equipment (telecommunications systems) I am rather disappointed in this book. There are basically two chapters that are useful while the rest are intended for aerospace applications. Fine, aerospace is a "sexier" application; but with the large number of engineers (ever growing) now looking at trying to keep 15W ASICs cool while avoiding EMC issues and/or manufacturing problems this book misses the boat.
Anyone who has taken the TTI course (Dick Leatherman) or one of the other professional institutes around North America won't get anything from this textbook since it simply captures what's in your notes. For everyone else just wondering about this book - it isn't worth the money.
The negatives: - the units (US imperial) are only useful in the US. The rest of the engineering world intelligently uses SI... - only two sections that are applicable to packaging engineering or other non-aerospace. - outdated technology. - no details on design fundamentals of cooling units (fans, blowers) - only two references to acoustic noise in the entire book! This is inexcusable for electronic equipment! - no discussion of integrating EMC solutions with thermal solutions.
Not recommended unless you like shelfware...

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Details infallible techniques for designing electronic hardware to withstand severe thermal environments. Using both SI and English units throughout, it presents methods for the development of various reliable electronic systems without the need of high-speed computers. It also offers mathematical modeling applications, using analog resistor networks, to provide the breakup of complex systems into numerous individual thermal resistors and nodes for those who prefer high-speed digital computer solutions to thermal problems.

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